Our factory is a world leader in the development and manufacturer of dicing blades and processes used in the dicing of silicon-based ICs, hard material Microelectronic Components (MECs) and in package singulation in China.

Nickel-bond Dicing Blades


The Nickel binder provides longer blade life and lower wear rate and together with the abrasive makes Nickel-bond Blades a perfect choice for soft material applications such as: PCB, Silicon and BGA
Blade thickness varies from 0.8 mil to 20 mil (depending on diamond grit size)
Diamond grit size ranges from 2-4 microns to 70 microns (depending on blade thickness)




Resin-bond Dicing Blades


Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic Substrates, HTCC and Glass
Resin Blade thickness varies from 3 mil to 100 mil (depending on diamond grit size)
Diamond grit size ranges from 3 microns to 250 microns (depending on blade thickness).





Metal-bond (Sintered) Dicing Blades


With slower wear rate than Resin but faster than Nickel, Metal-bond (Sintered) blades are best suited for retaining package shape and size in applications such as: BGA, Soft Alumina, TiC, LTCC and Ferrite
Blade thickness varies from 3 mil to 60 mil (depending on diamond grit size)
Diamond grit size ranges from 2 microns to 70 microns (depending on blade thickness)